Key information

Destination: Siem Reap, Cambodia

Dates: 24 June - 7 July 2024

Program cost: $4,200 + airfares


  • 27 x $3,000 New Colombo Plan Mobility Grants available for eligible undergraduate students
  • $9,504 OS-HELP Loans available for eligible students

Program eligibility: Undergraduate Engineering students

Application deadline: 31 March 2024


The Engineering in Complex Environments in Cambodia exposes participants to the complexities of working as a professional engineer in complex systems and environments. The program allows participants to deeply explore the intersections between engineering, technology and the creation of social impact. 

Students will be challenged and supported to develop a deep understanding of the role engineering and technology play in creating positive impact. Students will gain experience in socio-technical skills and mindsets, best practice appropriate technology development, designing in resource constrained environments, working with community and clients to identify needs, define problems and design solutions and working in cross-cultural contexts.


  • 5-day homestay
  • Vist UNESCO World Heritage site - Angkor Wat
  • Floating villages


The 14 day Design Summit is divided into three phases:

Phase 1 - Siem Reap: Students participate in a series of introductory and preparation sessions on human-centred design, appropriate technology, development, Cambodian history, culture and language. Phase 1 takes place over 2-3 days. 

Phase 2 - Community Homestay: In teams, students conduct community consultations, asset mapping and needs analysis from which they develop a design solution to locally identified design opportunities. The homestay includes visits to a community forest, market garden, aquaculture and other small-scale economic activities and involvement in local culture and day to day activities over five nights and six days.

Phase 3 - Siem Reap: Students return to Siem Reap to finalise their designs and prototypes, before returning to community to present them to local stakeholders. Phase 3 takes place over 3 days.

Academic information

Which unit/s can this program be taken for as credit?

EAT20008 (4 weeks credit to work experience)

Can this unit be taken as an elective by students in any Swinburne degree? 



This program is open to 2nd, 3rd and 4th year Engineering students who need to complete EAT20008 (Professional Experience in Engineering).

Hot air balloons above Angkor Wat

Program cost

$4,200 + airfares

See below for the list of inclusions and exclusions of the program fee.


  • Accommodation (twin-share)
  • Breakfasts and lunches
  • Welcome and Farwell Dinner
  • Ground transport
  • Travel and medical insurance
  • Site visits and excursions


  • International airfares
  • Visa
  • Medical checks and any neccessary injections
  • Personal expenses


Funding your overseas journey may be easier than you think

New Colombo Plan Mobility Grant

This program has 27 x $3,000 New Colombo Plan Mobility Grants available for eligible students.

These grants provide financial support to help alleviate the expenses associated with your overseas program. Australian undergraduate students that meet all eligiblity criteria may apply. Students can apply for a grant as part of the application process.


Eligible Australian students can also apply for an Australian Government OS-HELP Loan of up to A$9,504 (depending on your program location) to help cover costs associated with your overseas program.

For more information on funding and eligibility, see Fee Help and Scholarships.

Information sessions

To attend an information session, register your interest and we'll send you further details.

Upcoming information sessions


Register your interest


Keen to apply? You can submit your application now. Applications will be assessed after the application deadline.

Final application deadline: 31 March 2024

For further details on this program, please contact:

Alastair de Rozario
Mobility Adviser - Study Tours 

03 9214 6872

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